ASTM B885-2009 印刷线路板触点上存在杂质的标准试验方法
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【英文标准名称】:StandardTestMethodforPresenceofForeignMatteronPrintedWiringBoardContacts
【原文标准名称】:印刷线路板触点上存在杂质的标准试验方法
【标准号】:ASTMB885-2009
【标准状态】:现行
【国别】:
【发布日期】:2009
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:B02.11
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:边缘卡连接器;印刷线路板指针;接触电阻;污染;电触点材料;杂质含量;印刷线路板(PWB)触点/指针;线路板
【英文主题词】:contactresistance;contamination;edgecardconnector;printedwiringboardfingers;Contactresistance;Contamination;Edgecardconnector;Electricalcontactmaterials;Foreignmattercontent;Printedwiringboard(PWB)contacts/fingers;Wiringboards
【摘要】:Thistestmethodprovidesawaytodetectcontaminationonprintedwiringboardfingersthataffectstheelectricalperformanceofsuchfingers.SuchcontaminationmayariseduringPWBmanufacture,circuitassembly,orservicelifeandmayincludesoldermask,solderflux,hardenedlubricants,dust,orothermaterials.Thistestmethodprovidesanondestructivemethodofinspectingsuchfingersatanypointinthelifeoftheproductincludingafteroriginalmanufacture,afterassemblyofcircuitcomponentstothePWB,andaftertimeinservicesuchaswhenreturnedforrepair.Becausethistestmethodusestwoprobestofingercontactsinseries,itprovidesasensitivetestforcontaminantsthatmayincreaseelectricalresistancewhenthefingersarepluggedintoanedgecardconnectorthattypicallymakescontacttothefingerthroughonlyonecontacttofingerinterface.PracticeB667describesamoregeneralprocedureformeasuringcontactresistanceofanysolidmaterialinpracticallyanygeometricalform.ThemethodinPracticeB667shouldbeusedforgeneralstudiesandfundamentalstudiesofelectricalcontactmaterials.1.1ThistestmethoddefinesaresistanceprobingtestfordetectingthepresenceofforeignmatteronPrintedWiringBoard(PWB)contactsorfingersthatadverselyaffectselectricalperformance.Thistestmethodisdefinedspecificallyforsuchfingerscoatedwithgold.Applicationofthistestmethodtoothertypesofelectricalcontactsortofingerscoatedwithothermaterialsmaybepossibleanddesirablebutmayrequiresomechangesinfixturing,procedures,orfailurecriteria.1.2PracticeB667describesanothercontactresistanceprobemethodthathasmoregeneralapplicationtoelectricalcontactsofvariousmaterialsandshapes.PracticeB667shouldbeusedformorefundamentalstudies.Thistestmethodprovidesafastinspectionmethodforprintedwiringboardfingers.1.3ThevaluesstatedinSIunitsaretoberegardedasstandard.Nootherunitsofmeasurementareincludedinthisstandard.1.4Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.ItistheresponsibilityoftheuserofthisstandardtobecomefamiliarwillallhazardsincludingthoseidentifiedintheappropriateMaterialSafetyDataSheet(MSDS)forthisproduct/materialasprovidedbythemanufacturer,toestablishappropriatesafetyandhealthpractices,anddeterminetheapplicabilityofregulatorylimitationspriortouse.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:3P.;A4
【正文语种】:
【原文标准名称】:印刷线路板触点上存在杂质的标准试验方法
【标准号】:ASTMB885-2009
【标准状态】:现行
【国别】:
【发布日期】:2009
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:B02.11
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:边缘卡连接器;印刷线路板指针;接触电阻;污染;电触点材料;杂质含量;印刷线路板(PWB)触点/指针;线路板
【英文主题词】:contactresistance;contamination;edgecardconnector;printedwiringboardfingers;Contactresistance;Contamination;Edgecardconnector;Electricalcontactmaterials;Foreignmattercontent;Printedwiringboard(PWB)contacts/fingers;Wiringboards
【摘要】:Thistestmethodprovidesawaytodetectcontaminationonprintedwiringboardfingersthataffectstheelectricalperformanceofsuchfingers.SuchcontaminationmayariseduringPWBmanufacture,circuitassembly,orservicelifeandmayincludesoldermask,solderflux,hardenedlubricants,dust,orothermaterials.Thistestmethodprovidesanondestructivemethodofinspectingsuchfingersatanypointinthelifeoftheproductincludingafteroriginalmanufacture,afterassemblyofcircuitcomponentstothePWB,andaftertimeinservicesuchaswhenreturnedforrepair.Becausethistestmethodusestwoprobestofingercontactsinseries,itprovidesasensitivetestforcontaminantsthatmayincreaseelectricalresistancewhenthefingersarepluggedintoanedgecardconnectorthattypicallymakescontacttothefingerthroughonlyonecontacttofingerinterface.PracticeB667describesamoregeneralprocedureformeasuringcontactresistanceofanysolidmaterialinpracticallyanygeometricalform.ThemethodinPracticeB667shouldbeusedforgeneralstudiesandfundamentalstudiesofelectricalcontactmaterials.1.1ThistestmethoddefinesaresistanceprobingtestfordetectingthepresenceofforeignmatteronPrintedWiringBoard(PWB)contactsorfingersthatadverselyaffectselectricalperformance.Thistestmethodisdefinedspecificallyforsuchfingerscoatedwithgold.Applicationofthistestmethodtoothertypesofelectricalcontactsortofingerscoatedwithothermaterialsmaybepossibleanddesirablebutmayrequiresomechangesinfixturing,procedures,orfailurecriteria.1.2PracticeB667describesanothercontactresistanceprobemethodthathasmoregeneralapplicationtoelectricalcontactsofvariousmaterialsandshapes.PracticeB667shouldbeusedformorefundamentalstudies.Thistestmethodprovidesafastinspectionmethodforprintedwiringboardfingers.1.3ThevaluesstatedinSIunitsaretoberegardedasstandard.Nootherunitsofmeasurementareincludedinthisstandard.1.4Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.ItistheresponsibilityoftheuserofthisstandardtobecomefamiliarwillallhazardsincludingthoseidentifiedintheappropriateMaterialSafetyDataSheet(MSDS)forthisproduct/materialasprovidedbythemanufacturer,toestablishappropriatesafetyandhealthpractices,anddeterminetheapplicabilityofregulatorylimitationspriortouse.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:3P.;A4
【正文语种】:
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